k. Hussain, A. P. S. and khayon shibram, R. (2017) “Material Requirements Planning System (MRP) for Assembly Line of the Ground Phone (CID-103) in the Electronic Industries Company (EIC).”, Association of Arab Universities Journal of Engineering Sciences, 24(3), pp. 63-76. Available at: https://jaaru.org/index.php/auisseng/article/view/54 (Accessed: 23November2024).