k. Hussain S, khayon shibram R. Material Requirements Planning System (MRP) for Assembly Line of the Ground Phone (CID-103) in the Electronic Industries Company (EIC). ASSOC ARA UNIV J ENG SCI [Internet]. 24Oct.2017 [cited 20Dec.2024];24(1):47-0. Available from: https://jaaru.org/index.php/auisseng/article/view/23